導熱矽膠片

Applications產品應用端               

• Computer services: CPU, Heat sink,Memory modules
• LED Lighting, LCD-TV
• Military Electronics
• Power Supplies
• Telecom services, Wireless instruments
• Automotive control services

 

Description產品說明

Y-310C&Y-310S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic component.

Y-310C&Y-310S 系列熱傳導介面材料是填充發熱器件和散熱片或金屬底座之間的 空氣間隙，它們的柔性、彈性特徵使其能夠用於覆蓋非常不平整的表面。熱量從分離器件或整個PCB傳導到金屬外殼或擴散板上，從而能提高發熱電 子元件的效率和使用壽命。