Thermal Interface Material(TIM) is a medium used to accelerate the heat transfer between the thermal element and the heat generating chip. It can effectively transfer the heat energy from the chip to the thermal element to reduce the temperature of the chip, improve the life of the chip and the performance of the product. Our main products include Thermal pad, Thermal glue, Thermal grease, Thermal putty, Aluminum material and Thermal Conductive Tape, etc.
Gen Ye is committed to providing the necessary Thermal Simulation for the thermal engineering of the growing 5G communications, Notebook, PC, IC, MOS, Mobile phone, Telecom devices, Home application, Electric Vehicle, Medical equipment and Graphics that are in need in heat dissipation. Among them, the important components in the heat dissipation module can be customized according to requirements.
Gen Ye is committed to providing the necessary Thermal Simulation for the thermal engineering of the growing 5G communications, Notebook, PC, IC, MOS, Mobile phone, Telecom devices, Home application, Electric Vehicle, Medical equipment and Graphics that are in need in heat dissipation. Among them, the important components in the heat dissipation module can be customized according to requirements.
