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  • Products
    • Thermal Pad
      • Y-P Series
      • Y-GP Series
    • Ultra Soft Thermal Pad
      • Y-N Series
      • Y-GN Series
    • Heat Pipe
    • Thermal Grease
      • Thermal Grease
    • Thermal Gel
      • Thermal Putty
    • Thermal Adhesive
      • Thermal Glue
    • Aluminum Material
    • Composite Materials Heat Sink
      • KF Series
      • CM Series
    • Metal Stamping Parts
    • Absorbing Material
    • Ceramic Heat Sink
      • Ceramic Heat Sink
    • Other products
      • Thermal Insulation Rubber Cap
      • Non-Silicone Thermal Pad
      • Glass fiber thermal conductive tape series
      • Absorbing material series
      • Conductive Foam
      • Graphite Series
  • Quality & Research
    • About Research
    • Quality
  • Solutions
  • NEWS
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  • Contact us
  • 選單連結
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                        Computer
With the progress of the times, science and technology change rapidly; therefore, computers are developing in the direction of lightweight, thin, high-power pile, etc. For example, from Desktop computer to Notebook, wired headphone to Bluetooth headset, mostly to reduce the size of the product. However, due to the limitation of volume, the space for heat dissipation is continuously compressed, which requires professional heat dissipation technology. Gen Ye electronics with professional technology of heat dissipation, can provide heat dissipation solutions.
 
 




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