• Y-GN Series 1

Y-GN Series

Features：

  • Natural Viscosity
  • Very soft & High compressibility
  • Good Electrically Isolating
  • Easy to Assembly
  • Cost Effective
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Features：

  • Natural Viscosity
  • Very soft & High compressibility
  • Good Electrically Isolating
  • Easy to Assembly
  • Cost Effective
Production information

Applications

  • Computer services: CPU, Heat sink, Memory modules
  • LED Lighting, LCD-TV
  • Military Electronics
  • Power Supplies
  • Telecom services, Wireless instruments
  • Automotive control services
 

Description

Y-GN Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic component.
 

Technical Data Sheet



  1. Please use double-sided adhesive cautiously to avoid back viscosity
  2. Please keep manufacture process clean to avoid contaminate tinted conducting strip
 

Storage and preservation

  1. The manufacture of product/Conditions for storage：Temperature：25℃以下;Humidity：40%~80%
  2. Please do not preserve the product in the surrounding of extremely high or low temperature or high humidity, and please get it preserved in normal temperature.
  3. Please do not fold, heavy stress the products or make it with access to solvent or organic chemical materials and should keep the product away from dust.
  4. Please get the surroundings clean for preservation.
  5. Shelf life/Preservation period :Without gummed: 90 days from the production thereof.Gummed: 30 days from the production thereof.
 

Operating manual

  1. Clean the surface of heat sink. If necessary, clean the heat sink base of any machine oils, greases, hand oils, or other contaminants with a lint free cloth-and solvent such as isopropyl alcohol, MEK,or toluene will work.
  2. Adhering the thermal pad. First peel off the thermal pad from the blue or transparent Mylar, as the following picture 1. Then install the pad to the heat sink’s -surface, as picture 2 and 3.
 

Quality of attention focus

  1. Please note that the use of the process to avoid Pad contact with any dirty, If the finger cover dirt please replace it.
  2. Due to the hardness of 25 to 35, there will be the following circumstances:
  • The sheet is easy to remove.
  • After the sheet is cut back easy to stick
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