Glass fiber thermal conductive tape series
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Production information
Product Information
- Good dimensional stability
- High bond strength to a variety of surfaces
- Great reliability
- High performance of thermally conductive
Producr Structure
Product Instructions
Products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors.This type of adhesive tape possesses ultimate bonding strength with low thermal impedance,
with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
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